The dataPOWER Core product offering consists of a comprehensive database management and analysis system, engineered to provide extensive capabilities to semiconductor engineers and managers.

Integrated Database
dataPOWER's integrated database is a multi-threaded relational database that is the backbone of the dataPOWER data and yield management system. To optimize productivity, it is necessary to organize, sort, and pinpoint data throughout the entire production continuum. dataPOWER takes any data from throughout the manufacturing process (from fab to final test) aligns, organizes and stores the data, and presents it in formats that allow users to analyze yield and production issues quickly, using variety of dataPOWER analysis tools. Using dataFLOW's integration with the database, users can control and automate the flow of data from all fab and test sites into the central server. All transfers are verified and tracked for full accountability with the dataPOWER data configuration and retrieval tools.

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Statistical Library and Analytical Tools
dataPOWER a powerful and capable statistical library to handle the needs of the most demanding yield management challenges from descriptive statistics to statistical modeling tools and advanced tools.

Statistical modeling library includes:
• Multiple Linear Regression
• Factorial ANOVA
• Nested ANOVA

Interactive Reports:
• Min / Max Incidence Summary
• Best Case / Worst Case Analysis
• Custom Summary Report (user-defined statistics)
• Delta Calculation Report (user-defined statistics and sub grouping)

Quickly and effectively summarizing large amounts of data is a crucial step in statistical data analysis. Exactly what information needs to be processed is a function of the user, the situation being analyzed and the target audience. It is essential to clearly, concisely and consistently present information based on the analysis of the data.

Some of the available reports include:

• Min / Max Incidence Summary
• Best Case / Worst Case Analysis
• Summary Report (user-defined statistics)
• Delta Calculation Report (user-defined statistics and sub grouping)

The Custom Summary Report makes more than fifty statistics available to summarize data. These are selectable in any combination and in any sequence. Reports can be saved in the database, and sorted on any field. Included are common descriptive statistics (mean, standard deviation, min., max., etc.), robust statistics (trimmed mean, quantiles, MAD), normality checks (skewness, kurtosis, Anderson-Darling test statistic), production statistics (capabilities, limits, margins, yields), as well as user-definable functions for additional flexibility. Custom report configurations can then be saved for later use. All saved report types can be run in batch mode.

The Delta Calculation Report summarizes the delta of more than fifty statistics for all selected parameters, based on selected indices. For example, the delta of the mean and standard deviation for a timing parameter can be reported across two or more temperatures.

dataPOWER Core Advanced Tools
Product Sensitivity Analysis (PSA)
compares PCM data to wafer sort parametric data for the product die that surround each PCM site, enabling the comparison of PCM and wafer sort parameter distributions to identify the sensitivity of product circuits to discrete device parameters.

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Reject Oriented Analysis (ROA)
a powerful tool used to develop and optimize test strategies through test sequencing, guard banding, and test elimination. ROA identifies the few tests in a group of parameters that can determine the majority of failures.

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Measurement System Comparison (MSC)
allows users to perform a controlled experiment to analyze the repeatability and reproducibility of test measurements. MSC provides statistical analysis capabilities to examine measurement variances that can occur between different systems or when repeating measurements on the same system.

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yieldOPTIMIZER™
a comprehensive analysis performed across a selected group of programs, lots, or wafers, to evaluate yield and binning trends. The two primary yieldOPTIMIZER charts are Bin Stacking and Lot Trend.

yieldOPTIMIZER includes:

• Yield Report —interactive report that plots bin statistics (y1 .y5, m, d0) or bin results at the technology, process, product, program and lot level.
• Yield Summary Report — summarizes yield, defect density, dollar variance, probe scrap, test time and other related parameters at the technology, family, product, program or lot levels. The report provides drill-down links to diagnostic charts and reports, such as the Trend, waferMAP, and Bin Stack tools.
• Lots Tested Report — provides a quick overview for a series of lots. The report contains a stacked bar chart with bars representing binning percentages by lot. Also, a gallery of binMAPs illustrates binning numbers according to the device location on the wafer.
• Zonal Report — queries the database for zonal anomalies, and produces charts displaying test data to help analyze zone-dependent production issues on a wafer.
• PCM Summary Report — summarizes raw PCM data at lot, wafer, and site level to identify and summarize failing wafers, lots and tests. The report output consists of two analysis worksheets: one with wafer-level summary data and one with lot-level summary data.

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Wafer mapping provides an intuitive graphical interpretation of metrology, PCM, bin and parametric test data. Through parametric and bin wafer mapping, a complete overview of the information in your data can be graphically represented and analyzed on the physical layout of the wafer. This allows you to swiftly detect, isolate, correlate and ultimately eliminate wafer-dependent issues. waferMAP offers an indispensable visual perspective of your wafer data by providing the ability to perform in-depth correlation of electrical test results to in-process inspection parameters.

Visual and statistical zonal analysis is provided by column, row, quadrant, circular zones, radial zones, and stepper fields. This enables the fast isolation of key areas of sensitivity.

Interactivity within all views allows test results to be examined and correlated from a variety of perspectives.

waferMAP features include:
• Parametric Wafer Maps
• Bin Maps
• Yield Maps
• Mathematical and Graphical Zonal Analysis
• Multiple Parametric or Bin Maps
• Composite (stacked) Maps
• Integrated Histograms
• X-Bar-S Charts by Zone
• Die Yield Maps
• ANOVA by Zone

waferMAP	binMAP

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